Heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids

ABSTRACT

The present invention discloses that the thermal conductive fluids in temperature difference are reversely transported by the first fluid piping and second fluid piping in parallel or quasi-parallel arrangement on the same end side to produce heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving article or space thereby forming a more uniform temperature distribution status on the heat absorbing or dissipating body ( 100 ) or the passively heat dissipation or absorption receiving article or space ( 200 ).

BACKGROUND OF THE INVENTION

(a) Field of the Invention

The present invention discloses a device by using multi-pipe to pass the thermal conductive fluids in reverse directions as the heat absorbing or dissipating body, more specifically it is disposed with at least one passage of the first fluid piping and at least one passage of the second fluid piping in parallel or quasi-parallel arrangement, wherein the first fluid piping and the second fluid piping is arranged for transporting the thermal conductive fluids constituted by gaseous or liquid state fluid, gaseous to liquid state fluid or liquid to gaseous state fluid in temperature difference to the passively heat dissipation or absorption receiving article or space in mutually reverse directions, so as to produce heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving article or space thereby forming a more uniform temperature distribution status on the passively heat dissipation or absorption receiving article or space.

(b) Description of the Prior

For the conventional heat absorbing or dissipating devices by passing through thermal conductive fluid as the heat absorbing or dissipating body constituted by gaseous or liquid state fluid, gaseous to liquid state fluid, or liquid to gaseous state fluid such as engine cooling water radiators, heat absorbing cooling energy discharge devices utilizing thermal conductive fluid, or heat dissipating warming energy discharge devices such as warming devices, heaters, or the warming energy transfer device, etc., as the flow direction of the thermal conductive fluid is fixed, larger temperature difference is formed at each position on the heat absorbing or dissipating body of the thermal conductive fluid.

SUMMARY OF THE INVENTION

The present invention discloses that the conventional application device using thermal conductive fluid in fixed flow direction as the heat absorbing or dissipating body for heat absorption or dissipation is improved to be constituted by a first fluid piping and a second fluid piping in parallel or quasi-parallel arrangement, wherein the first fluid piping and the second fluid piping is arranged for transporting the thermal conductive fluids constituted by gaseous or liquid state fluid, gaseous to liquid state fluid or liquid to gaseous state fluid in temperature difference to the passively heat dissipation or absorption receiving article or space in mutually reverse directions thereby when transporting thermal conductive fluids to perform heat absorbing or dissipating function the passively heat dissipation or absorption receiving article or space can form a more uniform temperature distribution.

BRIEF DESCRIPTION OF THE DWAWINGS

FIG. 1 is a main structural schematic view of a heat absorbing or dissipating device for being passed through by thermal conductive fluid at fixed flow direction being constituted by conventional heat absorbing or dissipating gaseous or liquid state fluid or gaseous to liquid state fluid, or liquid to gaseous state fluid, etc.

FIG. 2 is a temperature difference distribution diagram of FIG. 1 being operated for the heat absorbing cooling energy discharge device function.

FIG. 3 is a temperature difference distribution diagram of FIG. 1 being operated for the heat dissipating warming energy discharge device function.

FIG. 4 is a main structural schematic view of the heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids of the present invention.

FIG. 5 is a temperature difference distribution diagram formed on the structure shown in FIG. 4 being operated for heat absorbing cooling energy discharge device function.

FIG. 6 is a temperature difference distribution diagram formed on the structure shown in FIG. 4 being operated for heat dissipating warming energy discharge device function.

FIG. 7 is a main structural schematic view of the structure shown in FIG. 4 showing that the first fluid piping and the second fluid piping for directly reversely transporting thermal conductive fluids in temperature difference by multi-pipe directly constitute the common structural body and directly transfer thermal energy onto the passively heat dissipation or absorption receiving article or space.

FIG. 8 is a temperature difference distribution diagram formed on the structure shown in FIG. 7 being operated for heat absorbing cooling energy discharge device function.

FIG. 9 is a temperature difference distribution diagram formed on the structure shown in FIG. 7 being operated for heat dissipating warming energy discharge device function.

DESCRIPTION OF MAIN COMPONENT SYMBOLS

-   100: Heat absorbing or dissipating body -   101: First fluid piping -   102: Second fluid piping -   110: Thermal conductive fluid -   111: First fluid inlet -   112: First fluid outlet -   121: Second fluid inlet -   122: Second fluid outlet -   200: Passively heat dissipation or absorption receiving article in     solid, or colloid, or liquid, or gaseous state or space

DETAILED DESCRIPTION OF THE PREFERED EMBODIMENTS

FIG. 1 is a main structural schematic view of a heat absorbing or dissipating device for being passed through by thermal conductive fluids at fixed flow direction being constituted by conventional heat absorbing or dissipating gaseous or liquid state fluid or gaseous to liquid state fluid, or liquid to gaseous state fluid, etc., wherein the thermal conductive fluid (110) constituted by gaseous or liquid state fluid, or gaseous to liquid state fluid, or liquid to gaseous state fluid, etc conventionally is passed through the first fluid piping (101) to combine with the heat absorbing or dissipating assembly constituted by the heat absorbing or dissipating body (100) for 1) passing through the thermal conductive fluid (110) in the first fluid piping (101) to perform cooling or heating functions through the heat absorbing or dissipating body (100) onto the passively heat dissipation or absorption receiving solid, or colloid, or liquid, or gaseous state article or space (200); or 2) passing through the thermal conductive fluid (110) in the first fluid piping (101) to reversely receive the surrounding cooling or heating energy of the heat absorbing or dissipating body (100); said item 1) is often applied in engine cooling water radiators, heat absorbing cooling energy discharge devices utilizing thermal conductive fluid (110), or heat dissipating warming energy discharge devices such as warming devices, heaters, evaporators, condensers, or the cooling or warming energy transfer device, etc. wherein the latter item 2) is often applied in cooling or warming energy transfer devices; in the item 1) application, thermal conductive fluid (110) is inputting via the inlet of first fluid piping (101) at one side end of the heat absorbing or dissipating body (100) and outputting via another side end thereby forming a larger temperature difference between the inlet and outlet of the thermal conductive fluids (110) of the first fluid piping (101) of the heat absorbing or dissipating body (100), and similarly in the item 2) application, it will form a larger temperature difference between the inlet and outlet of the thermal conductive fluids (110) of the first fluid piping (101) of the heat absorbing or dissipating body (100), which are the defects of the conventional heat absorbing or dissipating device.

FIG. 2 is a temperature difference distribution diagram of FIG. 1 being operated for the heat absorbing cooling energy discharge device function; FIG. 2 shows that the thermal conductive fluid (110) in fixed flow direction as shown in FIG. 1 being operated in the conventional heat dissipating warming energy discharge functions appears in unidirectional flow path distribution, wherein when the thermal conductive fluid (110) passes through the first fluid piping (101) a larger temperature difference distribution status forms between the inlet and outlet of the thermal conductive fluids (110) of the heat absorbing or dissipating body (100).

FIG. 3 is a temperature difference distribution diagram of FIG. 1 being operated for the heat dissipating warming energy discharge device function, wherein FIG. 3 shows that the thermal conductive fluid (110) in fixed flow direction as shown in FIG. 1 being operated in the conventional heat absorbing cooling energy discharge function appears in unidirectional flow path distribution, wherein when the thermal conductive fluid (110) passes through the first fluid piping (101) a larger temperature difference distribution status forms between the inlet and outlet of the thermal conductive fluid (110) of the heat absorbing or dissipating body (100).

Aiming to above said phenomenon, the present invention innovatively discloses a device by passing thermal conductive fluids for heat absorption or dissipation which uses a method by respectively pumping the multi-pipe temperature difference fluids in reverse directions to produce heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving article or space thereby allowing the heat absorbing or dissipating thermal conductive fluid to appear the more uniform temperature distribution status.

FIG. 4 is a main structural schematic view of the heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids of the present invention, wherein the assembly structure of the heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids mainly comprises the following:

The heat absorbing or dissipating body (100): It is the heat absorbing or dissipating structural body made of thermal conductive material in solid, or colloid, or liquid, or gaseous state for receiving the thermal energy of the thermal conductive fluid (110) constituted by gaseous or liquid state fluid, gaseous to liquid state fluid, or liquid to gaseous state fluid inside the combined first fluid piping (101) and the second fluid piping (102) so as to perform heat absorbing cooling energy discharge operating function or heat dissipating warming energy discharge operating function onto the passively heat dissipation or absorption receiving solid, or colloid, or liquid, or gaseous state article or space (200), wherein the number of the heat absorbing or dissipating bodies (100) can be one or more than one;

The first fluid piping (101), the second fluid piping (102): It is made of good thermal conductive material for reversely passing the thermal conductive fluid (110) constituted by gaseous or liquid state liquid, gaseous to liquid state fluid, or liquid to gaseous state fluid for transferring thermal energy to the heat absorbing or dissipating body (100) made of good thermal conductive material in solid, or colloid, or liquid, or gaseous state, and the first fluid piping (101) and the second fluid piping (102) can be respectively constituted by one or more than one passage;

The first fluid inlet (111) of said first fluid piping (101) is parallel connected with the second fluid inlet (121) of said second fluid piping (102) to receive the inflow of the thermal conductive fluid (110) and the first fluid outlet (112) of said first fluid piping (101) is parallel connected with the second fluid outlet (122) of said second fluid piping (102) to receive the outflow of the thermal conductive fluid (110);

Said first fluid piping (101) and said second fluid piping (102) are parallel or quasi-parallel distributed in a plane structure or three-dimensional structure in the heat absorbing or dissipating body (100), and it is characterized by that the first fluid inlet (111) and the second fluid outlet (122) are installed at the location adjacent to the heat absorbing or dissipating body (100), while the first fluid outlet (112) and the second fluid inlet (121) are installed on another location adjacent to the heat absorbing or dissipating body (100) thereby the thermal conductive fluids (110) in two circuits inside the first fluid piping (101) and the second fluid piping (102) being installed on the heat absorbing or dissipating body (100) are respectively transported in reverse directions to commonly allow the whole temperature difference of the heat absorbing or dissipating body (100) more uniformly distributed for performing heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving solid, or colloid, or liquid, or gaseous state article or space (200).

The structural relationships between the heat absorbing or dissipating body (100), the first fluid piping (101), and the second fluid piping (102) as shown in FIG. 4 can be constituted by one or more than one relationships as following, include:

(1) The heat absorbing or dissipating body (100) is in a assembled structure with at least one of the first fluid piping (101) and the second fluid piping (102); or

(2) The heat absorbing or dissipating body (100) is in an integral structure with at least one of the first fluid piping (101) and the second fluid piping (102); or

(3) The function of the heat absorbing or dissipating body (100) is directly provided by at least one of the first fluid piping (101) and the second fluid piping (102), so as to absorb or dissipate heat onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200) without disposing the heat absorbing or dissipating body (100).

FIG. 5 is a temperature difference distribution diagram of the structure shown in FIG. 4 being operated for heat absorbing cooling energy discharge device function; as shown in FIG. 5, in the heat absorbing or dissipating body (100) constituted by solid, or colloid, or liquid, or gaseous state thermal conductive material as shown in the structure of FIG. 4, the first fluid inlet (111) of the first fluid piping (101) and the second fluid outlet (122) of the second fluid piping (102) are installed in adjacency, while the first fluid outlet (112) of the first fluid piping (101) and the second fluid inlet (121) of the second fluid piping (102) are installed in adjacency at another location for respectively transporting the two circuits of the thermal conductive fluid flows (110) in reverse directions, wherein the input flow of the thermal conductive fluid (110) appears at lower temperature status, while the output flow of the thermal conductive fluid (110) appears at higher temperature status, and the heat absorbing or dissipating body (100) appears at an intermediate temperature between the ones of input and output flows of the thermal conductive fluid (110) and appears more uniformly distributed along the heat absorbing or dissipating body (100) for performing heat absorbing and cooling energy discharge onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200) thereby avoiding localized over-low temperatures.

FIG. 6 is a temperature difference distribution diagram of the structure shown in FIG. 4 being operated for heat dissipating warming energy discharge device function; as shown in FIG. 6, in the heat absorbing or dissipating body (100) constituted by solid, or colloid, or liquid, or gaseous state thermal conductive material as shown in the structure of FIG. 4, the first fluid inlet (111) of the first fluid piping (101) and the second fluid outlet (122) of the second fluid piping (102) are installed in adjacency, while the first fluid outlet (112) of the first fluid piping (101) and the second fluid inlet (121) of the second fluid piping (102) are installed in adjacency at another location for respectively transporting the two circuits of the thermal conductive fluid flows (110) in reverse directions, wherein the input flow of the thermal conductive fluid (110) appears at higher temperature status, while the output flow of the thermal conductive fluid (110) appears at lower temperature status, and the heat absorbing or dissipating body (100) appears at an intermediate temperature between the ones of input and output flows of the thermal conductive fluid (110) and appears more uniformly distributed along the heat absorbing or dissipating body (100) for performing heat dissipating and warming energy discharge onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200) thereby avoiding over-high temperatures.

For the heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids, beside of transferring thermal energy via the heat absorbing or dissipating body (100), the first fluid piping (101) and the second fluid piping (102) can be parallel or quasi-parallel distributed in a plane structure or three-dimensional structure to directly constitute structural body, thereby the first fluid piping (101) and the second fluid piping (102) is arranged to directly reversely transport the thermal conductive fluid (110) constituted by gaseous or liquid state fluid, gaseous to liquid state fluid, or liquid to gaseous state fluid in temperature difference from the same end side thereby allowing the first fluid piping (101) and the second fluid piping (102) to directly perform heat dissipating warming energy discharge or heat absorbing cooling energy discharge on the passively heat dissipating or absorption receiving article or space; FIG. 7 is a main structural schematic view of the structure shown in FIG. 4 showing that the first fluid piping and the second fluid piping for directly reversely transporting thermal conductive fluids in temperature difference by multi-pipe directly constitute the common structural body and directly transfer thermal energy onto the passively heat dissipation or absorption receiving article or space; wherein the structure of FIG. 7 is constituted by the following:

The first fluid piping (101) and the second fluid piping (102): They are made of good thermal conductive material to constitute the common structural body for transferring thermal energy through the thermal conductive fluid (110) constituted by gaseous or liquid state liquid, gaseous to liquid state fluid, or liquid to gaseous state fluid to the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200), wherein the first fluid piping (101) and the second fluid piping (102) can be respectively constituted by one or more than one circuits; the first fluid inlet (111) of said first fluid piping (101) is parallel connected with the second fluid inlet (121) of said second fluid piping (102) to receive inflow of the thermal conductive fluid (110), and the first fluid outlet (112) of said first fluid piping (101) is parallel connected with the second fluid outlet (122) of said second fluid piping (102) to receive outflow of the thermal conductive fluid (110), while the first fluid piping (101) and the second fluid piping (102) the first fluid piping (101) and the second fluid piping (102)appear in parallel or quasi-parallel distributed in a plane structure or three-dimensional structure to constitute the common structural body, wherein it is characterized by that the first fluid inlet (111) of the first fluid piping (101) and the second fluid outlet (122) of the second fluid piping (102) are installed at the location adjacent to their common structural body, while the first fluid outlet (112) of the first fluid piping (101) and the second fluid inlet (121) of the second fluid piping (102) are installed on the another location adjacent to their common structural body, thereby for the first fluid piping (101) and the second fluid piping (102) in the multiple pipes of the common structural body to transport two circuits of the thermal conductive fluid flows (110) respectively in reverse directions thereby making the whole temperature difference of their common structural body more uniformly distributed in the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200) to perform heat absorption or dissipation onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200).

For the heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids of the present invention, the structural relationships between the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200), the first fluid piping (101) and the second fluid piping (102) include the following: the function of the heat absorbing or dissipating body (100) is directly provided by at least one of the first fluid piping (101) and the second fluid piping (102) to perform heat absorption or dissipation onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200), or to further use the first fluid piping and the second fluid piping that using multi-pipe to reversely transport thermal conductive fluids to directly constitute the common structural body and to directly transfer thermal energy onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200).

FIG. 8 is a temperature difference distribution diagram of the structure shown in FIG. 7 being operated for heat absorbing cooling energy discharge device function; as shown in FIG. 8, in the common structural body as shown in the structure of FIG. 7, the first fluid inlet (111) of the first fluid piping (101) and the second fluid outlet (122) of the second fluid piping (102) are installed in adjacency, while the first fluid outlet (112) of the first fluid piping (101) and the second fluid inlet (121) of the second fluid piping (102) are installed in adjacency at another location for respectively transporting the two circuits of the thermal conductive fluid flows (110) in reverse directions, wherein the input flow of the thermal conductive fluid (110) appears at lower temperature status, while the output flow of the thermal conductive fluid (110) appears at higher temperature status, and the common structural body appears at an intermediate temperature between the ones of input and output flows of thermal conductive fluids (110) and appears more uniformly distributed in the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200) to perform heat absorbing and cooling energy discharge onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200) thereby avoiding localized over-low temperatures.

FIG. 9 is a temperature difference distribution diagram of the structure shown in FIG. 7 being operated for heat dissipating warming energy discharge device function; as shown in FIG. 9, in the common structural body as shown in the structure of FIG. 7, the first fluid inlet (111) of the first fluid piping (101) and the second fluid outlet (122) of the second fluid piping (102) are installed in adjacency, while the first fluid outlet (112) of the first fluid piping (101) and the second fluid inlet (121) of the second fluid piping (102) are installed in adjacency at another location for respectively transporting the two circuits of the thermal conductive fluid flows (110) in reverse directions, wherein the input flow of the thermal conductive fluid (110) appears at higher temperature status, while the output flow of the thermal conductive fluid (110) appears at lower temperature status, and the common structural body appears at an intermediate temperature between the ones of input and output flows of thermal conductive fluids (110) and appears more uniformly distributed in the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200) to perform heat dissipating and warming energy discharge onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200) thereby avoiding localized over-high temperatures.

For applications of the heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids one or more than one methods based aforesaid operating principles according to application structural needs and cost considerations can be used to make the following designs, including:

For the heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids, the first fluid piping (101) and the second fluid piping (102) can be constituted by an integral type structure of the piping made directly using the structure of the heat absorbing or dissipating body (100);

For the heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids, the three of first fluid piping (101), second fluid piping (102) and heat absorbing or dissipating body (100) can be constituted by an assembled structure; or

For the heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids, the heat absorbing or dissipating body (100) for combination with the first fluid piping (101) and the second fluid piping (102) can be constituted by the structural unit of the single structural body in plate, block, or multi-fins shape, or the structural unit assembled by fins, and can be constituted by at least one structural unit;

For the heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids, the three of the heat absorbing or dissipating body (100) constituted by solid, or colloid, or liquid, or gaseous state thermal conductive material, the first fluid piping (101) and the second fluid piping (102) can be partly or all made to various geometric shapes while without changing the principles;

For the heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids, the thermal conductive fluid (110) is constituted by gaseous or liquid state fluid, gaseous to liquid state fluid, or liquid to gaseous state fluid;

For the heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids, the thermal conductive fluid (110) passing through the first fluid piping (101) and the second fluid piping (102) can be transported by pumping, evaporation, or heat-cold natural circulation;

For the heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids, the warming or cooling energy is discharged to the liquid state passively heat dissipation or absorption receiving article or space (200) through using the cold-heat natural circulation of fluid in temperature difference or forced fluid pumping to generate thermal transfer function of heat convention, radiation or conduction; or the warming or cooling energy is discharged to the solid or colloidal or liquid or gaseous state passively heat dissipation or absorption receiving article or space (200) through conduction;

For the heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids, the thermal conductive fluid (110) passing through the first fluid piping (101) and the second fluid piping (102) is closed-loop circulated or open-loop released.

The heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids of the present invention can be applied for various heat absorbing, or dissipating, or cooling heat conducting application devices, such as the cooling water radiators of the engine, heat absorbing cooling energy discharge device using thermal conductive fluid, or heat dissipating warming energy discharge device using thermal conductive fluid such as thermal energy, heater or thermal energy transfer devices for warming equipments, or heating or cooling for ceilings, walls or floors of the buildings, or cooling of photovoltaic panels, or heating or cooling for electrical machine or power machineries, or heat absorption and dissipation of various machine casings, heat pipe structures, structure casings, various chips or semiconductor components, ventilation devices, or the heat absorption, heat dissipation or thermal energy transfer of information, audio or image devices, or heat dissipation of various lamp or LED devices, or the heat absorption of the evaporator or heat dissipation or thermal energy transfer of condensers of air conditioning devices, or thermal energy transfer of mechanical devices, or heat dissipation of frictional heat loss, or heat dissipation or thermal energy transfer of electric heater or other electric heating home appliances or cooking devices, or heat absorption or thermal energy transfer of flame heating stoves or cooking devices, or heat absorption, heat dissipation or thermal energy transfer of earth layer or water thermal energy, plant or housing building or building material or building structure devices, heat absorbing or dissipation of water tower, or heat absorption, heat dissipation or thermal energy transfer of batteries of fuel cells, etc.;

As well as applied for thermal energy transfer in home appliances, industrial products, electronic products, electrical machines or mechanical devices, power generation equipments, buildings, air conditioning devices, industrial equipments or industrial manufacturing process. 

1. A heat absorbing or dissipating device by using multi-pipe to pass the thermal conductive fluids in reverse directions as the heat absorbing or dissipating body, more specifically it is disposed with at least one passage of the first fluid piping and at least one passage of the second fluid piping in parallel or quasi-parallel arrangement, wherein the first fluid piping and the second fluid piping is arranged for transporting the thermal conductive fluids constituted by gaseous or liquid state fluid, gaseous to liquid state fluid or liquid to gaseous state fluid in temperature difference to the passively heat dissipation or absorption receiving article or space in mutually reverse directions, so as to produce heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving article or space thereby forming a more uniform temperature distribution status on the passively heat dissipation or absorption receiving article or space.
 2. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein it mainly comprises the following: The heat absorbing or dissipating body (100): it is the heat absorbing or dissipating structural body made of thermal conductive material in solid, or colloid, or liquid, or gaseous state for receiving the thermal energy of the thermal conductive fluid (110) constituted by gaseous or liquid state fluid, gaseous to liquid state fluid, or liquid to gaseous state fluid inside the combined first fluid piping (101) and the second fluid piping (102) so as to perform heat absorbing cooling energy discharge operating function or heat dissipating warming energy discharge operating-function onto the passively heat dissipation or absorption receiving solid, or colloid, or liquid, or gaseous state article or space (200), wherein the number of the heat absorbing or dissipating bodies (100) can be one or more than one; The first fluid piping (101), the second fluid piping (102): it is made of good thermal conductive material for reversely passing the thermal conductive fluid (110) constituted by gaseous or liquid state liquid, gaseous to liquid state fluid, or liquid to gaseous state fluid for transferring thermal energy to the heat absorbing or dissipating body (100) made of good thermal conductive material in solid, or colloid, or liquid, or gaseous state, and the first fluid piping (101) and the second fluid piping (102) can be respectively constituted by one or more than one passage; The first fluid inlet (111) of said first fluid piping (101) is parallel connected with the second fluid inlet (121) of said second fluid piping (102) to receive the inflow of the thermal conductive fluid (110) and the first fluid outlet (112) of said first fluid piping (101) is parallel connected with the second fluid outlet (122) of said second fluid piping (102) to receive the outflow of the thermal conductive fluid (110); Said first fluid piping (101) and said second fluid piping (102) are parallel or quasi-parallel distributed in a plane structure or three-dimensional structure in the heat absorbing or dissipating body (100), and it is characterized by that the first fluid inlet (111) and the second fluid outlet (122) are installed at the location adjacent to the heat absorbing or dissipating body (100), while the first fluid outlet (112) and the second fluid inlet (121) are installed on another location adjacent to the heat absorbing or dissipating body (100) thereby the thermal conductive fluids (110) in two circuits inside the first fluid piping (101) and the second fluid piping (102) being installed on the heat absorbing or dissipating body (100) are respectively transported in reverse directions to commonly allow the whole temperature difference of the heat absorbing or dissipating body (100) more uniformly distributed for performing heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving solid, or colloid, or liquid, or gaseous state article or space (200).
 3. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein the structural relationships between the heat absorbing or dissipating body (100), the first fluid piping (101), and the second fluid piping (102) as shown in FIG. 4 can be constituted by one or more than one relationships as following, include: (1) The heat absorbing or dissipating body (100) is in a assembled structure with at least one of the first fluid piping (101) and the second fluid piping (102); or (2) The heat absorbing or dissipating body (100) is in an integral structure with at least one of the first fluid piping (101) and the second fluid piping (102); or (3) The function of the heat absorbing or dissipating body (100) is directly provided by at least one of the first fluid piping (101) and the second fluid piping (102), so as to absorb or dissipate heat onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200) without disposing the heat absorbing or dissipating body (100).
 4. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein the first fluid piping (101) and the second fluid piping (102) can be parallel or quasi-parallel distributed in a plane structure or three-dimensional structure to directly constitute structural body, thereby the first fluid piping (101) and the second fluid piping (102) is arranged to directly reversely transport the thermal conductive fluid (110) constituted by gaseous or liquid state fluid, gaseous to liquid state fluid, or liquid to gaseous state fluid in temperature difference from the same end side thereby allowing the first fluid piping (101) and the second fluid piping (102) to directly perform heat dissipating warming energy discharge or heat absorbing cooling energy discharge on the passively heat dissipating or absorption receiving article or space; it is constituted by the following: The first fluid piping (101) and the second fluid piping (102): They are made of good thermal conductive material to constitute the common structural body for transferring thermal energy through the thermal conductive fluid (110) constituted by gaseous or liquid state liquid, gaseous to liquid state fluid, or liquid to gaseous state fluid to the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200), wherein the first fluid piping (101) and the second fluid piping (102) can be respectively constituted by one or more than one circuits; the first fluid inlet (111) of said first fluid piping (101) is parallel connected with the second fluid inlet (121) of said second fluid piping (102) to receive inflow of the thermal conductive fluid (110), and the first fluid outlet (112) of said first fluid piping (101) is parallel connected with the second fluid outlet (122) of said second fluid piping (102) to receive outflow of the thermal conductive fluid (110), while the first fluid piping (101) and the second fluid piping (102) the first fluid piping (101) and the second fluid piping (102)appear in parallel or quasi-parallel distributed in a plane structure or three-dimensional structure to constitute the common structural body, wherein it is characterized by that the first fluid inlet (111) of the first fluid piping (101) and the second fluid outlet (122) of the second fluid piping (102) are installed at the location adjacent to their common structural body, while the first fluid outlet (112) of the first fluid piping (101) and the second fluid inlet (121) of the second fluid piping (102) are installed on the another location adjacent to their common structural body, thereby for the first fluid piping (101) and the second fluid piping (102) in the multiple pipes of the common structural body to transport two circuits of the thermal conductive fluid flows (110) respectively in reverse directions thereby making the whole temperature difference of their common structural body more uniformly distributed in the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200) to perform heat absorption or dissipation onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200).
 5. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claims 2 or 3, wherein the structural relationships between the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200), the first fluid piping (101) and the second fluid piping (102) include the following: the function of the heat absorbing or dissipating body (100) is directly provided by at least one of the first fluid piping (101) and the second fluid piping (102) to perform heat absorption or dissipation onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200), or to further use the first fluid piping and the second fluid piping that using multi-pipe to reversely transport thermal conductive fluids to directly constitute the common structural body and to directly transfer thermal energy onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200).
 6. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claims 2 or 3, wherein one or more than one methods based aforesaid operating principles according to application structural needs and cost considerations can be used to make the following designs, including: The first fluid piping (101) and the second fluid piping (102) can be constituted by an integral type structure of the piping made directly using the structure of the heat absorbing or dissipating body (100); The three of first fluid piping (101), second fluid piping (102) and heat absorbing or dissipating body (100) can be constituted by an assembled structure; or The heat absorbing or dissipating body (100) for combination with the first fluid piping (101) and the second fluid piping (102) can be constituted by the structural unit of the single structural body in plate, block, or multi-fins shape, or the structural unit assembled by fins, and can be constituted by at least one structural unit.
 7. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein the three of the heat absorbing or dissipating body (100) constituted by solid, or colloid, or liquid, or gaseous state thermal conductive material, the first fluid piping (101) and the second fluid piping (102) can be partly or all made to various geometric shapes while without changing the principles.
 8. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claims 2 or 3, wherein the thermal conductive fluid (110) is constituted by gaseous or liquid state fluid, gaseous to liquid state fluid, or liquid to gaseous state fluid.
 9. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claims 2 or 3, wherein the thermal conductive fluid (110) passing through the first fluid piping (101) and the second fluid piping (102) can be transported by pumping, evaporation, or heat-cold natural circulation.
 10. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claims 2 or 3, wherein the warming or cooling energy is discharged to the liquid state passively heat dissipation or absorption receiving article or space (200) through using the cold-heat natural circulation of fluid in temperature difference or forced fluid pumping to generate thermal transfer function of heat convention, radiation or conduction; or the warming or cooling energy is discharged to the solid or colloidal or liquid or gaseous state passively heat dissipation or absorption receiving article or space (200) through conduction.
 11. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claims 2 or 3, wherein the thermal conductive fluid (110) passing through the first fluid piping (101) and the second fluid piping (102) is closed-loop circulated or open-loop released.
 12. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claims 2 or 3, wherein it can be applied for various heat absorbing, or dissipating, or cooling heat conducting application devices, such as the cooling water radiators of the engine, heat absorbing cooling energy discharge device using thermal conductive fluid, or heat dissipating warming energy discharge device using thermal conductive fluid such as thermal energy, heater or thermal energy transfer devices for warming equipments, or heating or cooling for ceilings, walls or floors of the buildings, or cooling of photovoltaic panels, or heating or cooling for electrical machine or power machineries, or heat absorption and dissipation of various machine casings, heat pipe structures, structure casings, various chips or semiconductor components, ventilation devices, or the heat absorption, heat dissipation or thermal energy transfer of information, audio or image devices, or heat dissipation of various lamp or LED devices, or the heat absorption of the evaporator or heat dissipation or thermal energy transfer of condensers of air conditioning devices, or thermal energy transfer of mechanical devices, or heat dissipation of frictional heat loss, or heat dissipation or thermal energy transfer of electric heater or other electric heating home appliances or cooking devices, or heat absorption or thermal energy transfer of flame heating stoves or cooking devices, or heat absorption, heat dissipation or thermal energy transfer of earth layer or water thermal energy, plant or housing building or building material or building structure devices, heat absorbing or dissipation of water tower, or heat absorption, heat dissipation or thermal energy transfer of batteries of fuel cells, etc.; As well as applied for thermal energy transfer in home appliances, industrial products, electronic products, electrical machines or mechanical devices, power generation equipments, buildings, air conditioning devices, industrial equipments or industrial manufacturing process. 